One of the most challenging tasks that semiconductor product stakeholders have is making informed decisions about when a design is ready to receive security signoff. Leaders are often forced to decide when a product can proceed to tape-out and chip manufacturing based on incomplete or outdated information – all while balancing competing pressures to meet release timelines and minimize risk. And the same information gaps that bring uncertainty to the signoff process later complicate efforts to demonstrate the completeness and effectiveness of security validation measures to customers, auditors, and regulatory bodies.